• DOB Driverless AC230V LED Module PCB design Assembly 30W with led 123Lm/w for ceiling light
  • DOB Driverless AC230V LED Module PCB design Assembly 30W with led 123Lm/w for ceiling light
  • DOB Driverless AC230V LED Module PCB design Assembly 30W with led 123Lm/w for ceiling light
  • DOB Driverless AC230V LED Module PCB design Assembly 30W with led 123Lm/w for ceiling light
  • DOB Driverless AC230V LED Module PCB design Assembly 30W with led 123Lm/w for ceiling light
DOB Driverless AC230V LED Module PCB design Assembly 30W with led 123Lm/w for ceiling light

DOB Driverless AC230V LED Module PCB design Assembly 30W with led 123Lm/w for ceiling light

Technical data
• Rigid board LED module
• Input voltage: AC 230V, 50¨C60 Hz
• Power factor: > 0.97
• Efficacy of the module up to 123 lm/W
• Colour temperatures 2700K, 3000K, 4000K, 5000K
• High colour rendering index CRI > 80
• On-board push-in terminals (WAGO 2060)
• Low Total Harmonic Distortion THD<15%
• Heat-sink required to preserve nominal power
• Small colour tolerance
• Small luminous flux tolerances
• Direct connection to mains
• Dimmable
• Simple installation
• Life-time of 50,000 hours or more
• 2-year guarantee
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An Experienced Metal Core PCB Manufacturer

MANKUN's been manufacturing MCPCB Boards for 18+ years. Our full feature aluminum circuit boards making capabilities and Free DFM Check allow you to get high-quality aluminum PCBs done within budget. Our printed Aluminum PCBs are widely used for LED lighting, power equipment and automotive systems.


Item

PCB Production Capability

Base Material

Aluminium

Layer

1L

Finished inner/outer cooper thickness

1OZ

Aluminum thickness

1.6mm

Thermal Conductivity

2W/m.K

Minimum Size

1500mm 1layer

Controlled Impedance

¡À5%

Outline profile

Rout/ V-cut/ Bridge/ Stamp hole

Surface treatment

OSP


Check our Aluminum core PCB manufacturing capabilities in the following table:

Technical parameters and process capability of metal substarte(MCPCB)

ITEM

SPECIFICATION

Surface

LF HASL,immersion gold,immersion siliver,OSP

Layer

Single side,double sided Multilayer and special structure

Maximum PCB size

240mmx1490mm OR 490x1190mm

PCB thickness

0.4-3.0mm

Copper Foil thickness

H 1/2/3/4(oz)

Insulation layer thickness

50/75/100/125/150/175/200(um)

Metal Base thickness

AIuminum(1100/3003/5052/6061),Copper AIuminum

Metal Base thickness

0.5/0.8/1.0/1.2/1.6/2.0/3.2/5.0(mm)

Shaping

Die punching/CNC Route/V-Cut

Test

100% open&short test

Shaping tolerance

Die Punching<+- 0.05mm,CNC Route<+-0.15mm,V-CUT Thick residue>+-0.15mm

Hole tolerance

+-0.5mm

Min.Hole DIameter

Single side 0.5/Double sided PTH0.3MM

Solder mask

green/white/black/red/yellow

Min.letter height

0.8mm

Min.line space

0.15

Min.letter width

0.15

Sile screen color

blue/white/black/red/yellow

Sopecial hole

Spot facing/cup hole/buried via hole/buried tank

File format

Gerber,Protel,PowerPCB,AutoCAD etc



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